Global Communication Semiconductors and Xponent Photonics ink wafer foundry agreement

JANUARY 17, 2007 -- Per the agreement, GCS will manufacture Xponent's product portfolio using its proprietary laser and PIN PD processes.

JANUARY 17, 2007 -- Global Communication Semiconductors Inc. (GCS), a III-V compound semiconductor foundry services provider for the RF and optoelectronic industry, and Xponent Photonics Inc. (search for Xponent Photonics) have established a strategic partnership and wafer foundry agreement. GCS will manufacture Xponent's product portfolio using its proprietary laser and PIN PD processes under terms of the agreement.

"We're pleased to be working with GCS," asserts Jeff Rittichier, president and CEO of Xponent. "They have an outstanding track record of success with fabrication of state-of-the-art InP and GaAs devices and are right on target with the technology transfer. With the completion of the GCS transfer in late winter, Xponent will be the world's only completely fabless volume producer of optical components," he notes.

"We look forward to collaborating in a successful business relationship with Xponent as they continue their leadership in delivering high-quality and reliable optoelectronics products to the fiber optical communication markets," adds Jerry Curtis, CEO of GCS. "We are confident that Xponent will benefit from our four-inch high-volume wafer manufacturing capabilities to stay ahead of market competition."


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