Palomar Technologies adds fiber-align equipment and capabilities

March 12, 2004 Vista, CA -- Palomar Technologies has added fiber align and test capabilities and its FAST series of fiber-align equipment to its Process Development and Prototyping Services (PDPS). This addition provides OEMs and contract manufacturers with a full line of services for the manufacture of complex optoelectronic components and packages.

Mar 12th, 2004

March 12, 2004 Vista, CA -- Palomar Technologies has added fiber align and test capabilities and its FAST series of fiber-align equipment to its Process Development and Prototyping Services (PDPS). This addition provides OEMs and contract manufacturers with a full line of services for the manufacture of complex optoelectronic components and packages.

PDPS provides design, program management, parts sourcing, process development, assembly, test, and product implementation for products such as optoelectronic packages, MEMS devices, multichip modules, hybrids, highbright LEDs, and fiber-optic packages for medical, biotech, aerospace, defense, automotive, telecommunications, and data communications applications. Palomar develops the processes, selects the materials, develops assembly processes, proves out the assembly, manufactures the prototypes, tests for performance, and can handle low-volume manufacture. Palomar then transfers the process and manufacturing knowledge to the customer or the customer's selected high-volume manufacturer.

Palomar Technologies designs, manufactures, and supports complete assembly line solutions. This equipment and Palomar's process development expertise have been the core for PDPS. Products include automatic wire bonders for gold-wire bonding, precision ball bonding, and deep-access large-area wedge bonding for high-capacity, fine-pitch interconnect wire bonding. Automatic component placement cells provide accurate component placement and automatic die attach for precise automated assembly of high-performance optoelectronic components. The LDA Laser Diode Attach Assembly Cell eliminates manual processes by placing and attaching laser diodes to their packaging using a patented heat process that controls the reflow temperature for high yield with a placement accuracy of ±5 microns. Flip-chip applications are accomplished with Palomar's Gold Bumper and Thermosonic Compression Bonder.

The addition of Palomar's FAST Optical Align & Attach products enables Palomar to automate the active optical alignment and assembly of photonic components requiring laser weld and epoxy attachment. For example, the FAST 6 six-axis optical alignment system provides high-resolution, fast, accurate, and reliable assembly of an optical component, fiber, or fiber array to a device.

"As a manufacturer of capital equipment that automates the assembly of complex components, packages, and subsystems, we can help support the development of these new complex products based on our equipment set," said Kevin Kron, Palomar's Photonics Automation Division product manager. "We are responsive and flexible enough to quickly adapt and tailor our equipment to these new applications. We provide the OEM with a product that is verified and produced on automated equipment, offering validation of the viability of the product."

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