Crealights: Optical Transceivers based on Silicon Photonics Interposer

Crealights 800G, 1.6T and beyond Optical Transceivers based on Silicon Photonics Interposer Technology have integrated a compact modulator, photodiode and electrical fanout circuit in a silicon photonics (SiPh) interposer chip, where the DSP integrated with driver and TIA can be directly packaged on top of the SiPh interposer with wafer-level packaging (WLP) technology. In this way, the optical transceiver can be simplified with fewer components, enabling low-cost, high-capacity mass production. Additionally, the requirements on swing voltage and power are significantly reduced by short RF and power-supply paths, resulting in lower power consumption for optical transceivers. The SiPh interposer integrates compact optical modulators, photodiodes, passive optical components, and fan-out circuits for DSP chips. 

Judge’s comment: “Tighter integration of silicon photonics with other key silicon functions such as modulator drivers and TIAs will enable the greater density, performance, and lower power needed for scale-up and scale-across applications in data centers.”