Henkel: Loctite TCF 14001

Advances in optical transceiver capability, including 800G, 1.6T, and coherent optical modules, are addressing the speed, distance, latency, and bandwidth requirements by integrating larger, higher-density digital signal processing (DSP) chips. The high power density of these next-gen transceiver chips increases heat generation, which can limit transceiver performance if not adequately managed. Henkel’s Loctite® TCF 14001 is a high thermal conductivity liquid thermal interface material (TIM) engineered to meet the increasingly challenging demands of advanced transceiver technology. The gap filler’s 14.5 W/m-K thermal conductivity can help to elevate transceiver performance and operational reliability through effective heat management to reduce the total cost of ownership.

Judge’s comment: “Henkel’s Loctite TCF 14001 provides a useful solution for effective heat transfer between optical modules and heatsinks, which is critical to scaling transceivers to higher bit rates.”