TeraHop: 1.6T OSFP224 DR8 Silicon Photonics Transceiver

TeraHop’s 1.6T OSFP224 DR8 silicon photonics transceiver is designed to address the rapidly escalating bandwidth, latency, and power requirements of next-generation AI/ML workloads and large-scale cloud infrastructure. By leveraging a highly integrated silicon photonics platform, co-packaged high-speed electronics, and an advanced OSFP224 thermal architecture, the solution reduces power consumption and cooling overhead, both major cost drivers in AI data centers. Its co-optimized silicon photonics modulators, low-power DSP, and packaging architecture lower module power by up to 25% compared with traditional 112G-based implementations. This directly reduces operational expenses associated with electricity, cooling, and rack-level thermal management. Also, the module’s native 224 Gb/s electrical I/O and 8×200 Gbps optical lane design provides a seamless path for customers moving to 1.6T and future 3.2T interconnects, eliminating the need for disruptive infrastructure upgrades. A high-density DR8 interface helps customers maximize fiber utilization and simplify network topology. 

Judge’s comment: “The use of 224G lanes in TeraHop's 1.6T OSFP224 DR8 Transceiver helps make power and fiber efficient 1.6T and future 3.2T transceivers a reality.”