Corning unveils fiber, Cable, and connectivity solutions targeting AI data center networks
At this year’s OFC trade show, Corning showcased a host of new fiber, cable, and connectivity platforms.
The offerings include a multicore-fiber solution to drive density, a micro cable to interconnect multiple data centers, next-generation connectors to simplify and accelerate deployments, and co-packaged optics systems to enable the scale-out of larger AI networks and, eventually, the scale-up of GPU density.
Specifically, Corning focused on five main solutions:
Corning® Multicore Fiber Solution: As an integrated fiber, cable, and connectivity offering that packs multiple cores into a single fiber strand, the solution offers what it claims is four times the capacity per fiber within the standard 125-micron cladding footprint. According to Corning, this dense capacity per fiber simplifies data center installations by requiring up to 75% fewer connectors, reducing cable mass by up to 70%, and helping cut installation time by up to 60%.
Corning® Contour™ Flow micro cable: The high-density micro cable reduces cable diameter to maximize duct space and accelerate long-distance and campus interconnectivity for AI data centers. Optimized for density with Corning® SMF-28® fiber and Flow Ribbon technology, this new micro cable is about half the diameter of legacy ribbon cables, while delivering double the fiber (1728 fibers) in the same space as Corning’s most recent micro cable solution.
32-fiber MMC® connector option: Available for both traditional and blind-mate applications, the new 32-fiber solution further enhances fiber density and scalability for space-constrained, high-performance network environments.
MMC® connector with PRIZM® TMT ferrule: This expanded-beam ferrule technology integrated into an MMC connector platform allows precision‑aligned microlenses to transmit optical signals through a contactless connection rather than direct fiber‑to‑fiber contact.
It’s a smarter, more efficient approach to scale up connectivity — one that’s well suited for the volume and precision required in AI environments.
Co-packaged optics (CPO) technology: Corning showcased an end-to-end CPO system that includes detachable fiber array unit-based fiber-to-chip connectors, bend-resilient fibers optimized for short-length CPO applications, and pre-assembled trays that simplify installation and enable scalable deployments.
At OFC, Corning demonstrated a fully assembled CPO switch tray with Nexthop, showing how Broadcom silicon, Corning fiber array units, and advanced optical management come together as a manufacturable complete solution.
This new set of products is part of Corning® GlassWorks AI™ Solutions, the company’s AI solution set.
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