Co-Packaged Optics Status Check

Date: December 5, 2023
1:00 PM EST / 12:00 PM CST / 10:00 AM PST / 5:00 PM GMT
Sponsors: Lumentum & US Conec
Duration: 1 Hour

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Development work continues co-packaged optics. Meanwhile, various use cases beyond data center switch support have emerged. This webinar will look at the progress in co-packaged optics technology and cover the applications where it will likely be deployed initially. According to a recent CIR market forecast, the co-packaged optics modules market will reach $5.5 billion in 2027, including NPO products. Additionally, the research firm said that co-packaged optics provide a pathway to 1.6T and beyond.

 During this webinar, we’ll address various topics:

  • Datacenter applications and new use cases
  • Status of Laser technology enabling CPO solutions
  • Standards efforts driving interoperability in co-packaging technologies
  • The maturation of high-density VSFF card edge and on-card style connectors
  • Compatibility with a growing variety of fiber types



Sharon Hall
Senior Director
Strategic Product Management, Cloud and Networking

Sharon Hall is the Senior Director of Product Line Management for next generation External Laser Source (ELS) solutions at Lumentum, addressing CPO applications.  Throughout her career, Sharon has held a variety of roles in Product Marketing, Sales, and Product Line Management within the fiber optics industry including HP/Agilent/Avago/Broadcom, Bookham, Emcore, Oclaro and Lumentum. Sharon is an active member in the OIF and Ethernet Alliance.  She holds a B.S. in Industrial Engineering from San Jose State University. She is based in San Jose, CA.


Tom Mitcheltree
Advanced Technology Manager
US Conec

Tom Mitcheltree is the Advanced Technology Manager at US Conec, where he actively engages with the latest MPO connector technologies including MT ferrule options for structured cabling, transceiver, and hybrid blind mate applications.

With over 25 years of experience in telecom and datacom, Tom is a participating member of IEEE, OIF, and multiple MSAs including QSFP-DD, SFP-DD, OSFP, and COBO. He has been a contributing expert to IEC and TIA standards, including TIA-604-5 (FOCIS 5) and TIA-604-18 (FOCIS 18) and IPC 8497-1.

Tom holds a Bachelor of Science degree from Westminster College.


Jock Bovington, Ph.D

Jock Bovington is currently in Cisco’s Client Optics Group working on lasers and silicon photonics for data center interconnects. He the editor of the OIF Physical & Link Layer Working Group - Co-Packaging Track’s External Laser Small Form Factor Pluggable (ELSFP) project. He received Bachler’s degrees in both Physics, and Electrical Engineering from Seattle University, M.S. and Ph.D. degrees in Electrical Engineering from the University of California Santa Barbara (UCSB). During his graduate studies, he researched heterogeneous integration of III-V lasers with Si and Si3N4 waveguides and athermal laser design. As a member of Intel’s, Photonic Technology Lab he helped demonstrate the first CWDM link using hybrid laser technology. In 2014, he joined Oracle and demonstrated efficient hybrid III-V/Si lasers and flexible comb laser sources using Si micro-ring mirrors. This technology was spun out into Axalume, which he co-founded prior to joining Cisco. He has authored or co-authored more than 50 technical journal articles, conference publications, and patents in the area of III-V/Si photonic integration.


Sean Buckley

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