FEBRUARY 27, 2009 -- IPtronics (search Lightwave for IPtronics) has announced availability of solder-bumped devices for flip-chip applications of 40- and 120-Gbps parallel optical interconnects.
The solder-bumped offerings are designed to enable high-volume flip-chip applications with better performance, lower cost, and higher density compared to traditional wire-bonding technology. Flip-chip technology has been used extensively in consumer applications such as cell phones and laptop computers.
While wire-bonding is the technology of choice for prototyping and lower quantities, flip-chip technology is geared for low cost, high capacity mass production, according to the company. Better performance is achieved since fewer parasitics and reflections and less noise are induced compared to the case with wire-bonds, IPtronics asserts. Lower cost in production is achieved through a single standard reflow assembly process versus multiple wire-bond operations, which boosts module/OSA vendors' capacity. High density is achieved through the fact that additional space for the wire-bonds are no longer needed, the company adds.
IPtronics bases its solder-bump line on an established flow with its partner, ST Microelectronics. The flow is easily scalable to very high volumes and is less costly than compression bump technology or stud bumps, the company claims. The solder bumps are lead-free and ROHS compliant as well.
All production has been outsourced to STMicroelectronics. STM has certified IPtronics as a design center based on a unique partnership agreement and will guarantee IPtronics' customers production capacity.
IPtronics targets its four-channel products at InfiniBand DDR and QDR QSFP modules, active optical cables, 40GBase-SR4, video, and proprietary applications. The 12-channel products cater to SNAP12, CXP, and 100GBase-SR10. IPtronics expects that the solder bump technology will be widely used in optical subassemblies, also known as optical engines, for these applications.
The products are fully available.