Automated assembly of optoelectronic packages

Oct. 26, 2001--Palomar Technologies has designed and integrated an automated line for the production of optoelectronic packages. Depending on the package design and requirements, the line integrates Palomar's wire bonders and the company's new In-Situ UV Component Assembly Cell, which avoids problems inherent with "snap cure" methods such as out gassing, very small batch sizes, and short work times.

Palomar works with the customer to define the package requirements, then provides design, process, software, and application engineers to design, build, load, assemble, and test the line. All training, service, maintenance, and support are provided by Palomar Technologies.

The "hands-free," recipe-driven process assembles the components in the package and performs the first-level interconnect necessary to provide the component's electrical connection to the outside world. The line is integrated with a high-volume fluid dispenser, reflow oven, plasma cleaner, and inspection machines, with automatic handling between process stations. Processes include high accuracy component assembly with eutectic solder or epoxy, precision ball bonding, and wedge bonding for fine pitch devices. All presentation formats can be accommodated.

Palomar Technologies (Vista, CA) provides processes and equipment for precision automated assembly of optical, RF and microelectronic packages in the photonic, wireless, microwave, automotive, aerospace, and medical industries. For more information, visit the company's Web site at www.palomartechnologies.com.