Master Bond has developed Polymer System EP37-3FLF--an optically clear, two-component epoxy--for demanding applications requiring flexible bonds resistant to impact, cryogenic temperatures, and severe thermal cycling.
Its low exotherm also makes it an effective potting, encapsulating, and casting system, especially where wider cross section thicknesses are specified, says a spokesperson. It cures without stressing delicate electronic components.
Serviceable over the wide range of 4K to 250°F, EP37-3FLF cures at room temperature in 2 to 3 days, or faster at elevated temperatures. This epoxy offers a non-critical, 1-to-1 mix ratio by weight or volume, and a low mixed viscosity of 1,400 to 1,500 cps. Users can work with a 100-gram mass of the adhesive at room temperature for up to 90 minutes.
EP37-3FLF has a bond shear strength exceeding 2,000 psi and a T-peel strength of 25 pli. The flexible epoxy has an elongation of 180% and superior electrical insulation properties with a volume resistivity of 1x1014 ohm-cm. It bonds well to a variety of substrates, such as metals, glass, ceramics, rubbers, and many plastics.
Master Bond’s EP37-3FLF is a highly flexible, room temperature curing epoxy designed for high performance applications in many industries across a wide service temperature range.