OCTOBER 29, 2009 -- Master Bond's newly developed EP29LP-1 epoxy is a potting compound for use in large potting and encapsulating applications. Offering good compound flow, easy setup, and convenient handling, it exhibits a low exotherm, maximum pot life, and desirable electrical insulation qualities. The long working life at ambient temperatures exceeds 6 hours and qualifies this compound for filament winding applications. Its physical strength properties enhance component resistance to thermal shock; it also has high resistance to chemicals such as fuels, acids, bases, water, and salts. EP29LP-1 is a low-viscosity, two-part, optically clear epoxy designed to adhere to many substrates, including optical fibers and fibrous reinforcements such as glass, aramid, and graphite. The low viscosity speeds impregnation and facilitates air release. The availability of versatile cure schedules -- ambient temperature or accelerated elevated temperature cures -- simplifies manufacturing applications. The shear bond strength is greater than 3,500 psi, ensuring durable and long-lasting performance. The compound has a peak exotherm as low as 50 degrees Celsius to help avoid excess heat buildup and damage to thermally sensitive components. Extended operating temperature ranges from -74 to +120 degrees Celsius.
Master Bond intros potting compound with extended working life
OCTOBER 29, 2009 -- Master Bond's newly developed EP29LP-1 epoxy is a potting compound for use in large potting and encapsulating applications.
Oct 29th, 2009