FEBRUARY 24, 2009 -- Fujitsu Microelectronics Europe (FME; search Lightwave for Fujitsu) has announced the BATBOARD evaluation kit for its recently introduced ADC IP based on CHArge-mode Interleaved Sampler (CHAIS) technology. The BATBOARD is designed to enable early silicon characterization of a two-channel 56-GSa/sec 8-bit ADC using the single-chip ROBIN device (the first customer evaluation silicon for CHAIS technology) fabricated on Fujitsu's standard 65-nm CMOS technology.
The BATBOARD is designed to achieve a unique level of performance for the sampling of high-speed signals for evaluation purposes and is "ideal" for prototyping next generation test and measurement systems, according to FME. Two delay matched channels with greater than 15-GHz bandwidth are each sampled at 56 GSa/sec by the ROBIN chip. The captured 8-bit ADC signals are stored on-chip in memory, allowing data access at low speed via USB. Several trigger options are available, enabling the capture of transient events such as data edges and glitches. Low-loss material, suitable for lead-free assembly in high-reliability applications, has been used in the multi-layer PCB design, providing superior signal integrity.
"With the BATBOARD our customers can gain early access to our leading-edge ADC technology with an easy-to-use demonstrator that helps them solve the difficult problems of high-speed signal acquisition," said Neil Amos, director of the Communications Business Unit at FME. "The evaluation kit allows customers to prototype new high-end test systems, optical front-ends with breakthrough performance levels and enables them to do forward looking research."
FME says the BATBOARD evaluation kit contains everything needed to get started including evaluation board, single-ended to dual-channel differential signal splitter, PC-USB interface, and software. It is offered in two versions with the ROBIN chip either soldered to the PCB or mounted in a high-bandwidth socket.
The BATBOARD with a two-channel 56-GSa/sec 8-bit ADC in Fujitsu's CS200 65-nm process technology will be available in Q2 2009. The evaluation kit will be shown to customers for the first time during the OFC Conference in San Diego at the end of March 2009.
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