VI Systems presents 45G short reach receiver
SEPTEMBER 26, 2010 -- VI Systems GmbH has introduced the R40-850TB high-frequency ceramic micro-assembly for data rates up to 45 Gbps. The subassembly includes a multimode-fiber compatible photodetector chip, a transimpedance amplifier (TIA) integrated circuit, and the matching components.
SEPTEMBER 26, 2010 -- VI Systems GmbH has introduced the R40-850TB high-frequency ceramic micro-assembly for data rates up to 45 Gbps. The subassembly includes a multimode-fiber compatible photodetector chip, a transimpedance amplifier (TIA) integrated circuit, and the matching components. The integration is designed to improve dramatically the quality of the signal transmission.
The company says it has demonstrated the receiver using its V40-850M multimode-fiber coupled vertical cavity surface emitting laser (VCSEL) module as the transmitting device. The signal-to-noise (S/N) ratio measured at the receiver at -3 dBm optical power using non-return-to-zero pseudo-random bit sequence (PRBS 27-1) encoding at 40 Gbps exceeded S/N = 6.5, according to VI Systems.
VI Systems says the advantages of the optical subassemblies are in their low power consumption, with the driver and TIA ICs consuming below 130-150 mW at 40 Gbps each to improve the energy efficiency of datacenters.
The targeted applications include short-reach (0.5 m to 10 km) and very short-reach systems as well chip-to-chip optical interconnects used in the high-performance computing industry. VI Systems also cites the future serial standards for electrical interfaces at data rates higher than the present ones of up to 14 Gbps currently being developed within the Infiniband EDR (26 Gbps per lane, 2011), Common Electrical Interface Standards (CEI-25/28G), Fibre Channel FC32G, and IEEE 40/100G Ethernet.
The work has been supported in part by the Project “Vertical Integrated Systems for Information Transfer” (VISIT) funded within the Seventh Framework Programme (FP7) of the European Union (EU). Members of the VISIT consortium are Intel (Ireland), IQE (UK), VI Systems (Germany), Chalmers University of Technology (Sweden), The University of Cambridge (UK), University College Cork (Ireland), The Technical University of Berlin (Germany), and the Ioffe Physical Technical Institute (Russian Federation).
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