OIF serves up external laser small form-factor pluggable (ELSFP) implementation agreement
OIF has debuted the External Laser Small Form-Factor Pluggable (ELSFP) Implementation Agreement (IA), defining a front panel pluggable form factor tailored to co-packaged optical systems and other multiple laser external laser source applications.
The ELSFP IA introduces what OIF says is the first multi-sourced future-proof front panel pluggable external laser source form factor to address the evolving needs of the industry. This IA offers numerous benefits, including definitions for the placement of laser sources at the front panel, the coolest section of the system, enhancing system reliability and allowing for efficient “hot-swap” field replacement when necessary.
Using a multi-fiber blind-mate optical connector positioned at the rear of the module, the ELSFP IA mitigates potential eye-safety risks, particularly in applications with high optical powers. Each ELSFP can supply optical power to one or more optical engines, all seamlessly managed by OIF’s Common Management Interface Specification (CMIS).
Also, this IA defines interoperability for mechanical, thermal, electrical and optical parameters and establishes standard power ranges and fiber configurations to focus the industry’s development. The final feature unique to ELSFP is the pass-through option which allows systems architects to maximize face plate real estate, solidifying ELSFP’s position as a versatile and adaptable solution for various optical networking applications.
While the ELSFP project was initially envisioned to complement the 3.2T co-packaged optical module, its f design makes it easily extensible to address future requirements.
“The ELSFP IA represents a significant milestone for the optical networking industry,” said Jeff Hutchins, OIF Board Member and Physical & Link Layer (PLL) Working Group Co-Packaging Vice Chair and Ranovus. “By providing a front panel pluggable external laser source form factor, we’re empowering network operators and equipment manufacturers with a solution that not only improves reliability but also paves the way for future innovations.”
He added, “The ELSFP’s flexible design accommodates the industry's ever-changing needs, enabling seamless integration with OIF’s 3.2T co-packaged optical module project and beyond.”
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About the Author
Sean BuckleySean Buckley
Sean is the Editor-in-Chief of Lightwave. He establishes and executes Lightwave's editorial strategy across its website, email newsletters, events, and other information products. Before coming to Lightwave in July 2023, he served as editor of Broadband Communities. Earlier, he served as senior editor of FierceTelecom and the editor of the former Telecommunications Magazine. He got his start in the optical industry in 1998 when he became the editor of enterprise and optical networks at Information Gatekeepers. He has a BA in English from the University of Massachusetts, Boston, and lives in Dracut, Mass, with his wife, two sons, and his cat, Dove.
