Semtech offers XGS-PON OLT chipset

The company is showing of the GN7153B combo chip and the GN7055B multi-rate burst mode transimpedance amplifier (TIA) for XGS-PON optical line terminals (OLTs) at CIOE 2019.
Sept. 5, 2019
2 min read
BusinessWire
Xgspon Chipset Press 4800x2700 5d715f7df0cc3

Semtech Corp. (NASDAQ: SMTC) is using CIOE 2019 in Shenzhen, China, this week to launch what it asserts is the first XGS-PON merchant silicon chipset. The company is showing of the GN7153B combo chip and the GN7055B multi-rate burst mode transimpedance amplifier (TIA) for XGS-PON optical line terminals (OLTs).

The GN7153B supports OLT transmit and receive signals in a fully integrated fashion. On the receive end, the GN7153B supports both XG-PON (2.5G) and XG-SPON (2.5G/10G) signals; on the transmit side, the device leverages Semtech’s 10G EML driver with ClearEdge CDR technology to reset the signal jitter budget. An I2C programmable PLL loop bandwidth control and a variety of jitter filter modes enable transmit path optimization. The EML driver includes eye-shaping features and an automatic power control (APC) loop to enable what Semtech asserts is best-in-class transmit eye quality. The burst mode receive data path includes a multi-rate 2.5G/10G limiting amplifier with a fast burst mode signal detect function, integrated discharge circuit, and reset for short settling time.

Meanwhile, the GN7055B burst-mode TIA uses an external reset signal to meet the convergence time and burst dynamic range requirements of XGS-PON 2.5G and 10G transmissions. The device features a fast automatic gain control (AGC) loop to enable high dynamic range in burst mode applications. The GN7055B is offered in die form, supports industrial temperature range, and uses a single 3.3-V power supply, according to the company.

“XGS-PON will bring a new generation of faster optical broadband services for home and business to the largest sector of the PON market,” said Dr. Timothy Vang, vice president of marketing and applications for Semtech’s Signal Integrity Products Group. “Our chipset contributes to that growth by bringing high performance and low cost.”

For related articles, visit the Optical Technologies Topic Center.

For more information on optical semiconductors and suppliers, visit the Lightwave Buyer’s Guide.

To stay up to date with optical technology, subscribe to the Lightwave Enabling Technology Newsletter.

About the Author

Stephen Hardy

Editorial Director and Associate Publisher, Lightwave

Stephen Hardy is editorial director and associate publisher of Lightwave and Broadband Technology Report, part of the Lighting & Technology Group at Endeavor Business Media. Stephen is responsible for establishing and executing editorial strategy across the both brands’ websites, email newsletters, events, and other information products. He has covered the fiber-optics space for more than 20 years, and communications and technology for more than 35 years. During his tenure, Lightwave has received awards from Folio: and the American Society of Business Press Editors (ASBPE) for editorial excellence. Prior to joining Lightwave in 1997, Stephen worked for Telecommunications magazine and the Journal of Electronic Defense.

Stephen has moderated panels at numerous events, including the Optica Executive Forum, ECOC, and SCTE Cable-Tec Expo. He also is program director for the Lightwave Innovation Reviews and the Diamond Technology Reviews.

He has written numerous articles in all aspects of optical communications and fiber-optic networks, including fiber to the home (FTTH), PON, optical components, DWDM, fiber cables, packet optical transport, optical transceivers, lasers, fiber optic testing, and more.

You can connect with Stephen on LinkedIn as well as Twitter.

Sign up for Lightwave Newsletters
Get the latest news and updates.