OIF releases the Integrated Packet Optical SDN IA, previews 224-Gbps CEI project

June 4, 2020
The Integrated Packet Optical SDN IA defines a standardized universal open framework for integrated software-defined networking (SDN) control of packet and optical networks.

OIF members held what appears to have been a productive Q2 2020 Technical and MA&E Committees Meeting. By the end of the meeting, held virtually May 11-15, OIF members had agreed to release the Integrated Packet Optical SDN Implementation Agreement (IA), previewed a proposed 224-Gbps Common Electrical Interface (CEI) project, and elected a Physical and Link Layer Working Group chair.

The Integrated Packet Optical SDN IA defines a standardized universal open framework for integrated software-defined networking (SDN) control of packet and optical networks. Principal use cases are defined as well. The new IA can be downloaded here.

“OIF’s Integrated Packet Optical SDN IA brings meaningful use cases, architecture, and technical requirements for cooperation between IP and optical layers via SDN,” said Junjie Li, China Telecom and OIF Network Operator Working Group Chair. “Operators look to OIF as a place to address industry gaps and achieve maximum benefit for their optical networks. I believe this work will help us to construct a bridge between packet and optical and make our network smarter and simpler.”

Meanwhile, OIF members began consideration of what requirements the industry may have beyond those addressed by CEI 112G. The members decided to begin an exploratory program in the third quarter of this year that would look at the potential of doubling the data rate to 224G. The project will investigate such areas as necessary reach, modulation formats, simulation tools, and test and measurement procedures.

“By providing an active forum for discussions on next-generation architectures and data rate beyond 112 Gbps, OIF is performing an essential role in accelerating standards and requirements. We expect this project to result in output data and baseline materials that will drive next-generation CEI clauses and enable 1.6-Tbps rate architectures,” said Nathan Tracy, TE Connectivity and OIF president. “In addition, it is anticipated this next-generation electrical rate will keep the industry on track to deliver lower cost and complexity 400 Gbps and 800 Gbps architectures as well.”

How such an investigation might play out could be gained by attending the OIF webinar Lightwave will host on June 19. Titled “Cu (see you) beyond 112 Gbps,” the 2.5-hour webinar will feature presentations from nine speakers, including Tracy. Additional information, including a registration link, can be found on the webcast landing page. The group also will host a members-only webcast on “Co-packaging of Optics with ASICs” on Monday, July 20.

OIF members also re-elected Dave Stauffer, Kandou Bus, S.A., as Physical and Link Layer Working Group chair through January 2022.

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