OIF has published a CEI-224G framework white paper that will lay the foundation for future projects related to 224-Gbps/per lane interfaces. The white paper describes the work of the CEI-224G Framework Project, which has completed its investigation of communications and computer hardware interconnection applications that might benefit from interconnection definitions or specification-defining Implementation Agreements (IAs).
Areas covered in the CEI-224G framework project white paper include:
- 224-Gbps reaches and architectures
- key technical challenges for next-generation systems
- definitions of electrical interconnection applications
- interoperability test challenges
- baseline materials that will enable 1.6/3.2-Tbps architectures and lower cost, lower complexity 800-Gbps and 400-Gbps architectures.
“As demonstrated in the past, most recently at 112 Gbps, OIF plays a key role in driving industry activity to identify and develop critical technical solutions that will enable next-generation data rates to be cost-effectively deployed in future equipment and networks,” said Cathy Liu, Broadcom Inc., and OIF president.
“224 Gbps is going to bring many difficult challenges for the industry to address to achieve practical implementations in an interoperable way,” added Nathan Tracy of TE Connectivity and OIF vice president of marketing. “This framework project and its resultant white paper align OIF members and industry on many of the key hurdles. Overcoming obstacles can be achieved by having consensus amongst a broad cross-section of component, subsystem, and system suppliers to leverage new technologies that drive signaling, architecture, and integration developments.”
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