OIF publishes Common Electrical I/O (CEI) 5.0 Implementation Agreement for 112G interconnects

June 9, 2022
The IA specifies transmitter, receiver, and channel requirements for Extra Short Reach (XSR), Medium Reach (MR), and Long Reach (LR) interfaces for multi-chip-module, chip-to-chip, and high-speed backplane applications.

OIF has published the Implementation Agreement (IA) for Common Electrical I/O (CEI) 5.0 focused on 112-Gbps electrical interconnects. The IA specifies transmitter, receiver, and channel requirements for Extra Short Reach (XSR), Medium Reach (MR), and Long Reach (LR) interfaces for multi-chip-module, chip-to-chip, and high-speed backplane applications.

“This IA marks a new generation of specifications for 112G interfaces,” said Klaus-Holger Otto of Nokia, who is OIF Technical Committee chair. “It is a continuation of OIF’s proud history of adding next-generation data rates that enable broad interconnect solutions and are critical building blocks for several industry standards and platforms.”

“These new data-rate specifications will enable applications including backplane, chip-to-chip, and die-to-die interfaces within a package,” added David Stauffer of Kandou Bus, chair of OIF’s Physical and Link Layer (PLL) Working Group. “And it enables multiple applications, such as co-packaged optics. Definitions of interfaces within co-packaged die are unique to this IA and OIF’s work.”

CEI 5.0 follows on from CEI 4.0 for 56-Gbps interconnects, which OIF released in 2018 (see “OIF publishes CEI 4.0 for CEI-56G 56-Gbps applications”). The new IA is part of a busy opening six months of 2022 for OIF, which also took control of Common Management Interface Specification (CMIS) development from the QSFP-DD MSA and issued updated CMIS specifications (and started a follow-on project), completed a framework IA for co-packaging, and launched six new projects.

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About the Author

Stephen Hardy | Editorial Director and Associate Publisher, Lightwave

Stephen Hardy is editorial director and associate publisher of Lightwave and Broadband Technology Report, part of the Lighting & Technology Group at Endeavor Business Media. Stephen is responsible for establishing and executing editorial strategy across the both brands’ websites, email newsletters, events, and other information products. He has covered the fiber-optics space for more than 20 years, and communications and technology for more than 35 years. During his tenure, Lightwave has received awards from Folio: and the American Society of Business Press Editors (ASBPE) for editorial excellence. Prior to joining Lightwave in 1997, Stephen worked for Telecommunications magazine and the Journal of Electronic Defense.

Stephen has moderated panels at numerous events, including the Optica Executive Forum, ECOC, and SCTE Cable-Tec Expo. He also is program director for the Lightwave Innovation Reviews and the Diamond Technology Reviews.

He has written numerous articles in all aspects of optical communications and fiber-optic networks, including fiber to the home (FTTH), PON, optical components, DWDM, fiber cables, packet optical transport, optical transceivers, lasers, fiber optic testing, and more.

You can connect with Stephen on LinkedIn as well as Twitter.

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