Conexant Xenon SoC targets FTTH, FTTN apps

July 27, 2005 Newport Beach, CA -- Conexant Systems has entered the fiber access market by introducing its integrated Xenon system-on-a-chip (SoC) platform. The company says device is designed for use in optical network terminals (ONTs) on the client-side of broadband passive optical networks (BPONs).

July 27, 2005 Newport Beach, CA -- Conexant Systems has entered the fiber access market by introducing its integrated Xenon system-on-a-chip (SoC) platform. The company says device is designed for use in optical network terminals (ONTs) on the client-side of broadband passive optical networks (BPONs).

The Xenon system platform can also be used in conjunction with the company's Accelity VDSL/VDSL2 chipset in fiber-to-the-neighborhood (FTTN) applications, to enable the delivery of triple-play voice, video, and data services. The company says the platform is the first in its family of planned devices for PON networks, and is currently being deployed by service providers worldwide.

"We have leveraged our system design expertise and technical leadership position in DSL to deliver the world's most integrated and lowest-system-cost broadband passive optical network semiconductor solution," comments Akram Atallah, vice president and general manager of broadband access for Conexant.

The Xenon processor integrates a standard-compliant ITU G.983 BPON MAC/framer and network processor into a single device for bridging and router applications. The single-chip platform is based on a high-performance dual-ARM9 core network processor, and supports downstream data rates of 622 Mbit/sec and upstream rates of 155 Mbit/sec. Also, according to the company, a version of the device optimized for multiple dwelling unit (MDU) applications provides 25% greater throughput, and seamlessly interfaces to the company's Accelity VDSL/VDSL2 chipset.

The device includes support for the company's ISOS suite of communications software, which the company says accelerates the integration of new features, reduces customer development costs, and streamlines product development, while allowing for customization. The platform also includes support for quality of service (QoS), Voice over Internet Protocol (VoIP), and IP video multicasting in triple-play applications.

The Xenon processor is packaged in a 528-pin plastic ball grid array (PBGA) and priced at $29.90 each in quantities of 10,000.

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