Lantiq intros 300-Mbps capable FTTdp chipset

Broadband access and home networking semiconductor vendor Lantiq has announced commercial availability of VINAX dp, a chipset optimized for fiber-to-the-distribution point (FTTdp) applications.

Broadband access and home networking semiconductor vendor Lantiq has announced commercial availability of VINAX dp, a chipset optimized for fiber-to-the-distribution point (FTTdp) applications.

The Lantiq VINAX dp chipset enables aggregated (upstream and downstream) 300 Mbps over VDSL2 at distances up to 200 m between a customer premises gateway and the fiber-optic network distribution point. This will provide telecoms operators and Internet service providers (ISPs) with an immediate response to competitive challenges by cable providers and to meet network performance goals set by government broadband initiatives, the company claims.

FTTdp is a cost-effective alternative to fiber-to-the-home (FTTH) network installations, the vendor asserts. Since it can be line-powered from the customer premises, the FTTdp unit can be placed conveniently in carrier-managed locations, while on the subscriber end, the standard VDSL CPE and power feeder is self-installed (see "Lantiq intros reverse-powered fiber to the distribution point").

Based on Lantiq’s carrier-grade VDSL2 chips developed for line card applications, the new chipset operates in industrial temperature ranges and the low power consumption of the FTTdp unit enables installation in outdoor boxes with passive cooling.

Key features of the new chipset include the 300-Mbps aggregated data rate with G.INP (retransmission) downstream and upstream and tightly integrated Lantiq carrier-class VDSL2 and GPON (FALC ON) technology. Based on its VINAX central office platform, Lantiq says it has demonstrated interoperability of the new chip set on both ends of the connection: GPON and VDSL.

The typical power consumption for the VINAX dp chipset is 2.7 W. The entire system consumes less than 6 W, including VDSL, GPON, DC/DC converter and all other active and passive components.

Lantiq says it has partnered with several leading equipment manufacturers including Alcatel Lucent, ZTE, T&W, Aethra Telecommunications and others for successful field trials of its FTTdp products around the world. The new chip set and commercial systems based on it are available now, the vendor says.

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