IPtronics intros four-channel 25G chipset for parallel interconnects

IPtronics A/S, a developer of silicon for parallel optical interconnects, says it has demonstrated 4x25-Gbps operation of silicon optimized for 25- to 28-Gbps applications. The TIA/VCSEL driver chipset is the first in a row of dedicated devices for low-power, high-volume parallel optical interconnects primarily focused at computer communications.

IPtronics A/S, a developer of silicon for parallel optical interconnects, says it has demonstrated 4x25-Gbps operation of silicon optimized for 25- to 28-Gbps applications. The TIA/VCSEL driver chipset is the first in a row of dedicated devices for low-power, high-volume parallel optical interconnects primarily focused at computer communications.

Increasing requirements for bandwidth, density and lower power make parallel optics compelling for high-performance computing and cloud-based networking servers and routers. The key drivers are density, power, cost, and manufacturability. IPtronics’ new chip set addresses all of these requirements, the company says.

“Overall, the ecosystem has matured to deliver at interconnects at 25G,” said Henning Lysdal, vice president of engineering at IPtronics. “The developments in VCSEL, photo diode, connector, and packaging technologies, combined with the availability of driver and receiver ICs, underline that parallel optical interconnects at 25 Gbps are not only within reach, but becoming a reality this year. Due to clear cost and flexibility advantages, the VCSEL-based approached is expected to be the technology of choice for short-reach parallel optical interconnects at 25G.”

IPtronics says it employs an advanced yet cost-efficient SiGe technology that offers low-power benefits and plenty of frequency headroom for this and future, faster products.

The ICs are suited not only for mid-board optics applications but also for InfiniBand EDR and 100G Ethernet and include advanced features addressing multiple module and system level challenges. The chip set is, by design, optimized for low-cost manufacturing and assembly.

IPtronics is currently working with a number of partners to develop 25G products. By working closely with module and system manufacturers, the new chips will greatly improve latency and density challenges, signal integrity, and rack-to-rack communication issues, the company claims.

IPtronics will exhibit at OFC in Los Angeles in March at booth #2647.

For more information on communications ICs and suppliers, visit the Lightwave Buyer’s Guide.

More in Electronics