GigOptix ramps production of 40G, 100G bundled products

Semiconductor supplier GigOptix, Inc. (NYSEAMEX:GIG) says its 40G and 100G bundled products will simplify product evaluation and enable faster time to market for its customers. The company’s bundled offerings include a thin-film polymer-on-silicon (TFPSTM) Mach-Zehnder modulator (MZM), the corresponding MZM drivers, transimpedance amplifiers (TIA), and their respective bias boards for a number of popular 40G and 100G modulation formats.

Semiconductor supplier GigOptix, Inc. (NYSEAMEX:GIG) says its 40G and 100G bundled products will simplify product evaluation and enable faster time to market for its customers. The company’s bundled offerings include a thin-film polymer-on-silicon (TFPS) Mach-Zehnder modulator (MZM), the corresponding MZM drivers, transimpedance amplifiers (TIAs), and their respective bias boards for a number of popular 40G and 100G modulation formats.

GigOptix offers three bundled product sets:

  1. GLX4220, a 40G DQPSK set that comprises one LX8220 TFPS MZM, one GX62255 MZM driver, and one GX3222B TIA
  2. GLX4320, a 40G RZ-DQPSK offering that comprises one LX8230 TFPS MZM, one GX62255 MZM driver, one GX6255 clock driver, and one GX3222B TIA
  3. GLX1420, a 100G DP-QPSK set that includes LX8240 TFPS MZM, two GX62255 MZM drivers, and two GX3222B TIA

“GigOptix is uniquely positioned amongst optical subcomponent vendors in that we provide the majority of the high-speed optical-electronic interface devices such as drivers, TIAs and modulators,” said Andrea Betti-Berutto, CTO at GigOptix. “This not only provides us with an in-depth appreciation of our customers’ system level challenges but also enables us to optimize the design and features of our TIAs, drivers, and modulators to improve performance and power efficiency, and to reduce customers’ R&D costs and development cycles by providing complete validated bundles for customers to utilize in their designs.”

The existing optical subcomponent ecosystem requires customers to source their MZM, driver, and TIAs from three different vendors before beginning work on making the devices interoperate in a design, the company explains. The bundled offers will make it possible to fast track this design effort.

The bundled products have been fully tested for component interoperability and with reference designs to ensure quick turn on and ease of use, the company adds.

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