MACOM Technology Solutions Inc. has unveiled the MATA-03820 and MATA-03819 four-channel (4x100G) 56/106-Gbps PAM4 linear transimpedance amplifiers (TIAs). The devices are currently available for flip-chip (MATA-03820) or wire-bonding (MATA-03819) based packaging approaches within 100G single-lambda-based 400G-FR4 and DR4 QSFP-DD and OSFP optical transceivers.
Both TIAs offer noise performance of less than 1.5 uA RMS typical and support bandwidth up to 35 GHz. Other features include RSSI for photo-alignment and power monitoring and an I2C management interface for control of bandwidth, output amplitude, peaking, loss of signal (LOS), gain, and other parameters.
At least one customer is impressed. “Molex is excited to collaborate with MACOM. Leveraging MACOM’s technical support along with its broad portfolio of TIAs, we are able to ensure the availability of industry-leading 400G optical modules,” said Adit Narasimha, vice president and general manager, Molex Optoelectronics. “The low noise performance of MACOM’s TIA along with its flexible programmability enable delivery of industry-leading low bit error performance when implemented with a DSP for 400G modules.”
Meanwhile, for customers targeting APD applications, MACOM says it is sampling its MATA-03921 (flip chip) and MATA-03919 (wire bonded) TIAs.
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