OIF publishes 3.2T Co-Packaged Module Implementation Agreement

April 6, 2023
As its name suggests, the Implementation Agreement (IA) defines a 3.2-Tbps co-packaged module that targets Ethernet switching applications, uses 100G electrical lanes, and provides backward compatibility with 50G lanes.

OIF says it has completed work on the OIF-Co-Packaging-3.2T-Module-01.0 – Implementation Agreement. As its name suggests, the Implementation Agreement (IA) defines a 3.2-Tbps co-packaged module that targets Ethernet switching applications, uses 100G electrical lanes, and provides backward compatibility with 50G lanes.

The specification set covers both optical module and passive copper cable assembly applications and will enable ~140G/mm of bandwidth edge-density. The IA can enable optical and/or electrical interfaces for a 51.2-Tbps aggregate bandwidth switch.

The new IA includes interoperability specifications for the 3.2-Tbps CPO modules that include:

  • 8x400-Gbps optical interface options for FR4 and DR4 connectivity
  • 32xCEI-112G-XSR host interface (or 32xCEI-56G-XSR in “backwards compatible” mode)
  • Opto-mechanical module specifications
  • Electrical specifications
  • Control and management interface, enabled by enhancements to the existing OIF CMIS specification.

“OIF’s members are committed to driving innovation and progress in co-packaging, continuously seeking ways to improve and innovate,” said Jeff Hutchins, OIF PLL Working Group co-packaging vice chair and board member, Ranovus. “This IA is part of a trio of projects which include the Framework project and the External Laser Small Form Factor Pluggable (ELSFP) project. Building on OIF’s successful track record of coherent and laser module IAs, it addresses the market need for interoperable integrated optics standardization identified by the CPO Framework IA.”

“Considerable progress has been made in co-packaging, and this new IA, along with a collaborative ecosystem, is a critical piece to propel the technology so that it meets industry needs, including that of cloud service providers as they build their next-generation AI networks,” added Richard Ward, technical editor of the OIF 3.2T Co-Packaged Module IA, Astera Labs.

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About the Author

Stephen Hardy | Editorial Director and Associate Publisher, Lightwave

Stephen Hardy is editorial director and associate publisher of Lightwave and Broadband Technology Report, part of the Lighting & Technology Group at Endeavor Business Media. Stephen is responsible for establishing and executing editorial strategy across the both brands’ websites, email newsletters, events, and other information products. He has covered the fiber-optics space for more than 20 years, and communications and technology for more than 35 years. During his tenure, Lightwave has received awards from Folio: and the American Society of Business Press Editors (ASBPE) for editorial excellence. Prior to joining Lightwave in 1997, Stephen worked for Telecommunications magazine and the Journal of Electronic Defense.

Stephen has moderated panels at numerous events, including the Optica Executive Forum, ECOC, and SCTE Cable-Tec Expo. He also is program director for the Lightwave Innovation Reviews and the Diamond Technology Reviews.

He has written numerous articles in all aspects of optical communications and fiber-optic networks, including fiber to the home (FTTH), PON, optical components, DWDM, fiber cables, packet optical transport, optical transceivers, lasers, fiber optic testing, and more.

You can connect with Stephen on LinkedIn as well as Twitter.

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