Opnext intros XFP with increased case temperature capabilities

January 20, 2005 Eatontown, NJ -- Optical component manufacturer Opnext Inc. today announced the addition of increased case temperature capabilities to its XFP 10G Serial Transceiver product family. With the addition of the TRF50x2, Opnext's XFP product suite provides enhanced high-density transmission, pluggability, and thermal design flexibility for telecom, datacom and storage customers, say company representatives.

The TRF50x2 is a 1310-nm XFP capable of operating in the case temperature range from -5 ° C to 85 ° C. This reflects a case temperature improvement of up to 10 ° C hotter than any conventional XFP available in the market, contends the company. By supporting the 85 °C case temperature, together with its very low power consumption of maximum 2 W, the product will enable customers whose systems are space-constrained and have less thermal capabilities to benefit from a module that can not only withstand a higher case temperature but also enables higher density on a single board.

"As the industry moves to 10G, there is increased need to add multiple modules on a single line card or to fit the modules to very constrained space, resulting in higher ambient temperatures around the module," explains Hirokuni Tsuji, senior director of product marketing for Opnext. "The Opnext XFP meets our customers' needs by providing them increased flexibility to design their systems to enable higher density on a single board."

The Opnext XFP is XFP MSA compliant and Hot Z pluggable (pluggable though front panels of system equipment). It includes an XFI electrical interface and is capable of maintaining data rates up to 11.3 Gbits/sec by utilizing a TOSA with Opnext's uncooled multiple quantum well (MQW) directly-modulated DFB LD chip with extremely high temperature operation capability. These same TOSAs can be used in 300-pin, XENPAK and X2 modules.

Product samples of the TRF50x2 will be available this quarter.