22 September 2003 Eatontown, NJ Lightwave--Opnext, a global provider of high-performance optical components, today announced it has extended its line of 300-pin transceivers with the TRV709A, a widely tunable transceiver for use in metro and long haul DWDM applications. The TRV709A is on display at the European Conference on Optical Communications (ECOC) 2003, held in Rimini, Italy this week.
Opnext is a co-founder of the 300-pin 10-Gbit/sec multisource agreement (MSA), and its existing 300-pin transponder and transceiver portfolio covers all applications, from legacy fiber to long reach (80-km and WDM). The highly integrated TRV709A includes a tunable laser that is capable of tuning full C-band with wavelength spacing of 50 GHz, and supports multiple rates from 9.95 to 10.71 Gbits/sec. It also features a LiNbOÂ©Ã½Mach-Zehnder modulator, high sensitivity avalanche photo diode, jitter filter, along with multiplexing/demultiplexing functionality in a 300-pin MSA-compliant package measuring 3.5x4.5x0.53 inches. Working samples of the TRV709A are scheduled for 2004.
At ECOC this week, Opnext is showing products and technology developments, which focus on three key areas of component design -- lower cost, smaller footprint, and higher performance. The small form-factor pluggable (SFP) portfolio consists of more than 30 individual products and covers all standard bit rates and protocols, from Gigabit Ethernet and Fibre Channel, to 155 Mbits/sec, 622 Mbits/sec and 2.5 Gbits/sec for SONET/SDH and ATM applications. The distances supported range from very short reach multimode applications, for the Gigabit Ethernet and Fibre Channel protocols, all the way up to 80 km and beyond for the SONET/SDH and Gigabit Ethernet protocols. The transceiver designs can operate across extended temperature ranges, and provide advanced real-time performance monitoring capabilities.
Further MSA-compliant modules include XENPAK, X2 and XFP 10-Gbit/sec pluggable transceivers. These products are based on Opnext's universal optical subassembly platform. Opnext is exhibiting at Booth 340 at ECOC held from September 22-24, 2003.
Formed out of Hitachi, Opnext brings over 30 years experience to the design, development and manufacture of high-performance components and subsystems that power today's access communications, backbone, metro, information and industrial markets.