Tyco's interconnect enables 40/100GbE hot-pluggable interface
SEPTEMBER 25, 2009 -- Tyco Electronics' new CFP-compliant interconnection system provides pluggability for 40- and 100-Gbps Ethernet applications.
SEPTEMBER 25, 2009 -- Tyco Electronics' new CFP-compliant interconnection system provides pluggability for 40- and 100-Gbps Ethernet (GbE) applications. The CFP-compliant components include a transceiver module plug connector, a host receptacle connector installed on the host board, and associated guide rails, receptacle cover, external bracket assembly, backer plate assembly, and a riding heat sink.
The CFP MSA specification defines a hot-pluggable optical transceiver form factor to enable 40/100GbE applications. Pluggable CFP-compliant transceivers will support ultrahigh-bandwidth requirements of data communications and telecommunication networks. Target equipment includes routers, switches, and optical transport equipment for applications ranging from long haul to data centers.
All components of Tyco Electronics' interconnection system were developed working in conjunction with the CFP MSA specification. "Tyco Electronics is continuing to demonstrate our commitment to supporting next-generation, ultrahigh-speed pluggable interface developments. We have worked closely with CFP MSA specifications to develop a system that provides the challenging levels of electrical and mechanical performance required by this next-generation interface," says Michael Walmsley, Tyco Electronics product manager.
The system addresses the advanced thermal management, EMI management, and signal integrity requirements of the MSA. The two-piece connector offers 148 positions, with state-of-the-art signal-integrity performance levels over 20 differential pairs to support four-channel 40-Gbps and ten-channel 100-Gbps operation. The module plug connector straddle-mounts to the board within the transceiver module, and the host receptacle connector surface-mounts to the host board.
The receptacle cover and the external bracket assembly both contain integrated EMI containment features to ease the task of EMI compliance for OEM line-card designers. Additionally, the CFP-compliant connector system is designed to enable belly-to-belly (double-sided) implementation for higher line-card density. A riding heat sink supports CFP optical transceivers that require additional thermal management.
Drawings and pricing can be provided upon request.