Integrated XFP controller-monitor pares down 10G module designs

March 15, 2006
March 15, 2006 Dallas, TX -- Dallas Semiconductor/Maxim's DS1862 is an integrated XFP controller-monitor developed to simplify the design of 10G XFP optical transceiver modules. The chip reduces component count and layout area in such modules by integrating the laser-driver control, system monitoring, and memory functionalities.

March 15, 2006 Dallas, TX -- Dallas Semiconductor/Maxim's DS1862 is an integrated XFP controller-monitor developed to simplify the design of 10G XFP optical transceiver modules. The chip reduces component count and layout area in such modules by integrating the laser-driver control, system monitoring, and memory functionalities.

With a register and memory architecture compliant with the XFP MSA, the DS1862 controls the laser driver with an average power control (APC) loop for bias current management and a 256-position temperature-controlled DAC for extinction ratio control. The device's integrated temperature sensor and 13-bit ADC monitor system temperature, Vcc, and five external analog signals. Programmable alarm and warning "trip points" for all monitored signals alert the system to out-of-tolerance conditions.

Fast trip comparators and a FET-drive output disable the laser in the event of an eye safety violation. An additional, integrated 8-bit DAC controls other system parameters such as the threshold voltage for the receive signal conditioner. An I2C serial interface enables device communication.

The DS1862 is available in a 5 x 5-mm BGA package (0.8-mm pitch) and operates over a -40°C to +100°C temperature range. A preliminary data sheet is available here: http://www.maxim-ic.com/DS1862. Pricing starts at $2.25 in 10k quantities.