SFP-DD MSA releases version 2.0 of interface specification

The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group has released version 2.0 of the SFP-DD pluggable interface specification. The new specification includes enhancements to the mechanicals, extended modules, and enhanced polarizing key for the SFP-DD electrical interface.

The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group has released version 2.0 of the SFP-DD pluggable interface specification. The new specification includes enhancements to the mechanicals, extended modules, and enhanced polarizing key for the SFP-DD electrical interface.

As the name implies, the MSA aims to develop a double-density SFP-sized optical module for 50-and 100-Gbps data center network applications using NRZ or PAM4 modulation, depending upon the data rate. The form factor’s electrical interface supports two lanes that operate up to 25-Gbps NRZ or 56 Gbps PAM4 per lane to support aggregate bandwidth of 50 Gbps via NRZ or 112 Gbps via PAM4 (see “SFP-DD MSA targets 50-Gbps, 100-Gbps optical transceivers”). The form factor, which will support up to 3.5 W and provide backwards compatibility with other SFP modules, is expected to be used in active optical cables, direct-attach copper cables, and transceivers.

‘’Through strategic collaborations we work to increase speed, density and scalability in next-generation servers,” said Scott Sommers, Chair of the SFP-DD MSA. “We effectively enhance the roadmap in network applications to meet the challenging demands data centers and enterprise networking platforms are up against.”

This is the third specification release for the MSA, following version 1.0 in September 2017 and version 1.1 earlier this year (see “SFP-DD MSA releases first module specifications” and "SFP-DD releases updated specification for pluggable interface").

SFP-DD MSA founding members include Alibaba, Broadcom, Cisco, Dell EMC, Finisar, Hewlett Packard Enterprise, Huawei, Intel, Juniper Networks, Lumentum, Mellanox Technologies, Molex, and TE Connectivity. Contributing members are Accelink, Amphenol, AOI, Foxconn Interconnect Technology, Fourte, Genesis, Hisense, Infinera, Innolight, Maxim, Multilane, Nokia, Oclaro, Senko, Source Photonics, US Conec, and ZTE. The new specifications are available from the MSA’s website.

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