As AI systems continue to expand in scale and bandwidth, interconnect density has become one of the biggest challenges in data center design. Copackaged and near-packaged optics architectures are emerging to meet these demands, integrating optical and electrical connectivity closer to the switch ASIC.
Optical interconnect technologies position the industry to address AI data center challenges across any connectivity path—scale-up, scale-out, or scaleacross—whether using CPO, NPO, or traditional pluggable optics, with fiber routed from front panels, backplanes, or mid-board locations.
Vendors such as Accelink, TE Connectivity, and US Conec are leading the field in mature, proven, and ready-to-scale optical solutions to meet rapidly growing AI infrastructure demands.
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