Sckipio says it broke new performance records at the Broadband World Forum by demonstrating speeds of more than 3.1 Gbps downstream and 900 Mbps upstream on production silicon using Gfast bonding running at 212 MHz.

The new Amendment 3 Gfast solution runs on two bonded pairs of CAT-3 wiring (regular twisted-pair copper telephone wires). The demonstration uses Sckipio's SCK23000 chipsets, Civica WanStaX software and the Microsemi WinPath network processor.

"Sckipio is pushing Gfast to astonishing speeds with production silicon," said David Baum, co-founder and CEO of Sckipio. "No other Gfast solution delivers end-to-end 212a profile bonding."