Xindium Technologies Inc. unveils plans for Indium Phosphide chipsets
March 4, 2002--Xindium Technologies Inc., an early-stage optoelectronic integrated circuit (OEIC) manufacturer, today revealed plans to enter the market for high frequency/high bit-rate semiconductor digital and optical component devices.
Xindium Technologies Inc., an early-stage optoelectronic integrated circuit (OEIC) manufacturer, today revealed plans to enter the market for high frequency/high bit-rate semiconductor digital and optical component devices. Founded in February 2001 with venture backing from Vantage Point Venture Partners and encouragement from the University of Illinois at Urbana-Champaign (UIUC), Xindium will design, license, and manufacture Indium Phosphide (InP)-based integrated devices for 40-Gbit/sec and higher bit-rate applications.
"Xindium's products target the demand for high performance/high bit-rate devices that are driving integration onto a common chipset," explains Cindana Turkatte, president and chief executive officer of Xindium. "Our expertise in the application and manufacture of high frequency Indium Phosphide devices gives us a powerful advantage. Early indications from customers have shown that we are on the right path with our technology, product development, and customer-driven approach," she adds.
Xindium's initial product offering will be customer selectable TIA and integrated PIN/TIA chips including chip-on-carrier devices for transceiver and transponder module makers. In addition, Xindium will produce a chip-on-carrier with a patent pending RF connector for more traditional transport module customers.
Xindium leverages much of its core technology from the advanced research conducted by the company's founders at UIUC over the past two decades.
For more information about Xindium Technologies Inc. (Champaign, IL), visit the company's Web site at www.xindium.com.