Lamina Ceramics receives $12-million in venture funding

January 14, 2002--Lamina Ceramics Inc., which employs proprietary technology to bond unfired ceramic to metal for use in communications and electronic components and packaging, announced today that it has obtained $12-million in venture capital funding.

Lamina Ceramics Inc., which employs proprietary technology to bond unfired ceramic to metal for use in communications and electronic components and packaging, announced today that it has obtained $12-million in venture capital funding. The funding comes from Morgenthaler, a national venture capital firm with many investments in wireless and optical communications, as well as from a major communications systems vendor. Sarnoff Corporation, the technology development firm that invented the bonding process, is also a major equity partner in Lamina.

Taylor Adair, Lamina's CEO, calls the company's technology "a Swiss army knife for solving next generation electrical and mechanical design problems." Bonded-ceramic-on-metal, he says, offers component and packaging customers a multifaceted tool that helps them significantly reduce size, lower system costs, and greatly improve performance.

The folks at Lamina Ceramics believe that bonded ceramic-on-metal will become the material of choice for a large number of next-generation packages and components where electrical and thermal performance are important. This includes all-optical and microwave transmitter circuits where heat must be efficiently dissipated as well as optical devices operating at or above 10 Gigabits.

For more information about Lamina Ceramics (Princeton, NJ) and its Low Temperature Co-Fired Ceramics on Metal technique, visit the company's Web site at www.laminaceramics.com.

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