International VC 3i invests $30m in DenseLight Semiconductors

Jan. 14, 2002
January 14, 2002--International venture capital group, 3i Group plc, has invested a total of $30 million in DenseLight Semiconductors Private Limited, a Singapore-based total photonics solution provider.

International venture capital group, 3i Group plc, has invested a total of $30 million in DenseLight Semiconductors Private Limited, a Singapore-based total photonics solution provider.

The investment includes funds from the $400-million 3i Asia Pacific Technology Fund and gives 3i the largest individual shareholding in the company. Existing shareholders include DenseLight's founders, members of the management team, NTU Ventures, and employees of the company.

The investment by 3i has been made over a 15-month period, following an initial seed round investment of $1.2 million made by 3i in October 2000. Throughout this period, 3i has been working closely with DenseLight management to build up DenseLight's manufacturing capability and expand its staff to manage what is now a fully operational facility. The investment was utilized to fund this development as well as to expand DenseLight's R&D program, which has resulted in 30 patent-pending inventions. During this period, DenseLight has been in stealth mode as it finalized the commercialisation strategy for its technology and product roadmap.

DenseLight has developed photonics technologies that the company believes for the first time enables the commercial fabrication of integrated optical subsystems incorporating both active and passive components onto a single indium phosphide chip. The company's proprietary DensePIC technology allows it to manufacture a range of high-performance indium phosphide (InP)-based photonic integrated circuits (PICs).

Headquartered in Singapore, DenseLight Semiconductors provides value-added component solutions for next-generation optical networks. For more information, visit the company's Web site at www.denselight.com.

Sponsored Recommendations

April 9, 2025
As transceiver speeds increase, so do thermal challenges. Discover key insights into innovative cooling solutions that ensure optimal performance and reliability.
March 7, 2025
In today’s hyperconnected world, rolling out and managing profitable, high-performance networks for access and transport will require innovative architectural approaches. The ...
Sept. 30, 2024
Join us for an interactive roundtable webinar highlighting the results of an Endeavor Business Media survey to identify how optical technologies can support AI workflows by balancing...
April 11, 2025
Taking a comprehensive approach to developing electronic products is the key to successful outcomes.