Modulight strengthens its position in Japan

December 2, 2002--Modulight Inc. and Japan's High-Tech Corp. signed a distribution agreement that results in immediate cooperation. The purpose of the agreement is to sell and promote Modulight's products in Japanese market. Modulight's product portfolio covers optoelectronic (OE) epiwafers, OE chips, and packaged components.
Dec. 2, 2002

Modulight Inc. and Japan's High-Tech Corp. signed a distribution agreement that results in immediate cooperation. The purpose of the agreement is to sell and promote Modulight's products in Japanese market. Modulight's product portfolio covers optoelectronic (OE) epiwafers, OE chips, and packaged components.

High-Tech Corp. and Modulight provide product solutions that cover processing of OE component to the levels specified by the customers. Modulight works in close cooperation with customers, offering them high product performance, customized products, cost-efficiency, and volume production capability.

According to Modulight's chief executive officer, Dr. Petteri Uusimaa, the company has cooperated with Japanese companies from the very beginning of the company: "With this agreement we will further strengthen our position in Japanese market. High-Tech Corp. has wide coverage in Japan and strong knowledge of optical products and the market segment in general. Working together with High-Tech Corp., we expect to have significant increase in our market share in Japan and further improve our profitability".

For more information about Modulight Inc. (Tampere, Finland), visit the company website at www.modulight.com.

Sign up for Lightwave Newsletters
Get the latest news and updates.