23 September 2003 Rimini, Italy -- At the European Conference on Optical Comminication today, Multiplex, Inc, the South Plainfield, New Jersey-based manufacturer of optoelectronic components and integrated subsystems, announced the availability of custom compound semiconductor foundry services.
Multiplex operates newly completed 10,000 sq. ft. class 1,000/10,000 cleanroom facilities at its headquarters in New Jersey. Complete front-end capabilities for III-V semiconductor expitaxial growth, processing device design, testing, reliability qualification and failure mode analyses are offered. Multiplex is ISO 9001-2000 certified for all phases of these capabilities.
The company maintains a state-of-the art MOCVD epitaxy platform that includes Aixtron 2400 and 2000 multi-wafer reactors, and all GaAs- and InP-based material systems are supported.
Available epitaxial services include 980, 1310 and 1550 nm laser platforms (FP, DFB, etc.) and other custom structures and wavelengths; PIN and APD wafers optimised for 2.5 Gbit/s (and below) and 10 Gbit/s receiver applications; and custom photosensor and imaging wafers and chips for 1.2 to 1.65 micron applications.
Multiplex's technical staff boasts more than 200 man-years of collective experience in MOCVD epitaxy. Other available foundry services include materials characterisation, processing services and device design/testing/qualification.
As a vertically integrated manufacturer, Multiplex possesses the in-house capabilities and expertise to handle these complex operations, and to provide a high degree of customization to meet specific and stringent customer requirements.
Dr. Won T. Tsang, Multiplex's President and CEO, says, "With the facilities to more than adequately handle these complex processes, this was a logical step for Multiplex. We have had a successful run of high-end finished products, and I am confident that opening up our facilities to the industry will prove to be equally successful."