Multilink introduces FEC processor, chipset and announces a strategic alliance with PMC-Sierra

March 29, 2001
Mar. 29, 2001--Multilink Technology Corporation introduced a series of products that reflect Multilink's commitment to the needs of the short, intermediate, long and ultra long haul transmission markets. The company also announced an alliance with PMC-Sierra to develop complete 10 Gb/s reference platforms for optical networking.

Multilink Technology Corporation introduced in March at the Optical Fiber Communication Conference (OFC) in Anaheim, CA, a series of products that reflect Multilink's commitment to the needs of the short, intermediate, long and ultra long haul transmission markets.

The first of these products is the MTC6130 FEC - SONET - Digital Wrapper Processor, a device aimed at the emerging Optical Networking Market. The MTC6130 provides full SONET/SDH section termination, Forward Error Correction (FEC) and G.709 Digital Wrapper termination for fiber optic transmission lines operating at 10 Gb/s. This device features full SONET/SDH Section Overhead (SOH) processing including frame alignment, scrambling, programmable BER monitoring and loss of input clock monitoring. This SONET/SDH capability allows performance monitoring, termination and regeneration for ease of system integration. The MTC6130 will allow Multilink to address semiconductor-based solutions for high-speed optical networks.

Also to address the high-speed fiber optic transmission market, Multilink introduced its latest chipset, the MTC1233 Multiplexer with integrated Clock Multiplier Unit (MUXCMU) and MTC1234 Demultiplexer with integrated clock and data recovery (CDRDMUX). This chipset offers a significantly increased level of integration by directly supporting the generation and recovery of Return-to-Zero (RZ) format data signals. Based on Silicon Germanium (SiGe) Technology, the low power chipset also supports Non-Return-to-Zero (NRZ) format signals, while operating at networking data rates of 10.0 Gb/s, 10.7 Gb/s or 12.3 Gb/s. The chipset is capable of addressing the needs of a variety of applications, including SONET OC-192, SDH STM-64, systems deploying Forward Error Correction (FEC), and Enhanced FEC in networks targeting Metro, Long Haul and Ultra Long Haul transmission distances.

Lastly, Multilink Technology Corporation (Multilink) and PMC-Sierra (NASDAQ: PMCS) announced a technical and marketing alliance to develop complete 10 Gb/s reference platforms for optical networking. The two companies will combine Multilink's newly announced SiGe SerDes chipset and Forward Error Correction (FEC) devices with PMC-Sierra's 10 Gigabit-per-second framer technologies to facilitate the rapid design of linecard solutions targeted for the Metro market. Customers will be able to leverage the features of each device at the system level and ensure SFI-4 industry interoperability between a framer device and a physical layer chipset from two different component vendors.

About Multilink:

Multilink Technology Corporation designs, develops and markets mixed-signal integrated circuits, modules, data link layer products and custom higher-level assemblies for the telecommunications and data communications industries. For more information, visit www.mltc.com.

Sponsored Recommendations

ON TOPIC: Innovation in Optical Components

July 2, 2024
Lightwave’s latest on-topic eBook, sponsored by Anritsu, will address innovation in optical components. The eBook looks at various topics, including PCIe (Peripheral...

PON Evolution: Going from 10G to 25, 50G and Above

July 23, 2024
Discover the future of connectivity with our webinar on multi-gigabit services, where industry experts reveal strategies to enhance network capacity and deliver lightning-fast...

Coherent Routing and Optical Transport – Getting Under the Covers

April 11, 2024
Join us as we delve into the symbiotic relationship between IPoDWDM and cutting-edge optical transport innovations, revolutionizing the landscape of data transmission.

Data Center Interconnection

June 18, 2024
Join us for an interactive discussion on the growing data center interconnection market. Learn about the role of coherent pluggable optics, new connectivity technologies, and ...