September 17, 2004 Horsham, PA -- Avo Photonics has announced it is offering its optical and RF packaging expertise to a wide range of markets, including communications. The company, founded this year, has financing from Zon Capital Partners.
"At Avo, we have the expertise to turn desktop designs and volume packaging needs into reality," said Dr. Paul Magill, CTO and vice president of business development. "Avo has the facilities, equipment and knowledge to allow OEMs to focus on their own strengths while feeling secure that their packaging needs are being met with the highest quality and efficiency by a trusted partner."
Avo supports its design capability with what it asserts is a complete suite of modeling tools, including RF, optical, thermal, and mechanical analysis. The tools ensure that products are ready for immediate prototyping and low-volume production, as well as the ability to flow to high-volume production without having to retool or requalify the design, according to Avo.
The company provides support for both custom and standard package designs, such as butterfly or TO can designs. Manufacturing processes to support these packages include laser welding, die bonding, flip chip, wire bonding, seam sealing, and optical fiber attach. Avo also provides failure analysis and supply chain management.
In addition to communications, Avo also will target the military/aerospace and medical/industrial markets.