CommScope (NASDAQ: COMM) and US Conec say they have signed a licensing agreement that will see both companies manufacture very small form factor (VSFF) fiber-optic connectors, starting with the MDC fiber connector. US Conec has developed the MDC for high-speed data center applications.
Manufactured with 1.25-mm ferrule technology, the MDC provides 3X the density of a typical LC. It is incorporated within the QSFP-DD MSA Hardware Specification 5.0 (see "QSFP-DD MSA releases Common Management Interface Specification 4.0 and Hardware Specification 5.0").
The companies believe that establishing CommScope as a second source of the connector will boost use of the MDC.
“The MDC duplex connector ushers in a new era of dual-fiber connectivity by delivering unmatched density, simple insertion/extraction, field configurability, and optimal carrier-grade performance,” said Joe Graham, president of US Conec. “The collaborative effort between US Conec and CommScope opens the door to rapid high-volume deployments with leading-edge connector technology to ensure robust supply chain demands are met.”
“This new, high-density connector format and multi-source agreement with US Conec will enable greater opportunity for innovation by providing a new platform for future connectivity solutions,” added Jamie Birdnow, vice president of market development and advance core technologies.
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