Henkel Corporation: Bergquist® Hi Flow THF 5000UT (Thermal Management Material)
High bandwidth ASICs/CPUs/GPUs for data processing in AI and MI applications integrate multiple large dies to achieve extraordinary data throughput, resulting in higher power densities and elevated operating temperatures. Henkel’s Bergquist® Hi Flow THF 5000UT is a silicone-free, phase change TIM that delivers thin bond line capability with low-pressure and low thermal impedance for large die processors and high-power applications. The material has been tested and validated for a wide power range of up to 800 W, helping protect high-value devices from damaging heat and pressure while maximizing performance to reduce overall operating expenses.
Judge’s Comment: “The ability to remove heat from ICs is fundamental to increasing the allowable speed of the ICs, thus increasing the capacity of subsystems, modules and systems.”
About the Author
Lightwave Staff
Through our integrated media portfolio, Lightwave’s editorial staff delivers content focused on broadband, fiber optics and optoelectronics, the technologies that enable the growth, integration and improved performance of voice, data and video communications networks and services. Our experienced editorial team provides trusted technology, application and market insights to corporate executives, department heads, project managers, network engineers and technical managers at equipment suppliers, service providers and major end-user organizations.