Henkel Corporation: Bergquist® Hi Flow THF 5000UT (Thermal Management Material)
High bandwidth ASICs/CPUs/GPUs for data processing in AI and MI applications integrate multiple large dies to achieve extraordinary data throughput, resulting in higher power densities and elevated operating temperatures. Henkel’s Bergquist® Hi Flow THF 5000UT is a silicone-free, phase change TIM that delivers thin bond line capability with low-pressure and low thermal impedance for large die processors and high-power applications. The material has been tested and validated for a wide power range of up to 800 W, helping protect high-value devices from damaging heat and pressure while maximizing performance to reduce overall operating expenses.
Judge’s Comment: “The ability to remove heat from ICs is fundamental to increasing the allowable speed of the ICs, thus increasing the capacity of subsystems, modules and systems.”
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