Source Photonics released its 200 Gbps PAM4 EML CoC (chip-on-carrier) products, initially demonstrated as a TOSA prototype during OFC 2023. It began production release to selected customers and was adopted internally in their newest 800G DR4/FR4 OSFP/QSFP-DD, 800G LR4 OSFP and 1.6T DR8/2xFR4 OSFP-XD designs. Targeting to support next-gen hyperscale and AI/ML data centers’ need for higher speeds and network capacity, Source Photonics is adding 200G PAM4 EML chips to its EML portfolio, including 28GBd and 56GBd EMLs.
Judge’s Comment: “This product is essential to the continued speed increases of the industry.”
About the Author
Lightwave Staff
Through our integrated media portfolio, Lightwave’s editorial staff delivers content focused on broadband, fiber optics and optoelectronics, the technologies that enable the growth, integration and improved performance of voice, data and video communications networks and services. Our experienced editorial team provides trusted technology, application and market insights to corporate executives, department heads, project managers, network engineers and technical managers at equipment suppliers, service providers and major end-user organizations.