SENKO, a manufacturer of optical interconnect solutions, has added five more patents to its ongoing lawsuit against US Conec.
The company said these five additional patents reinforce the inventions claimed in the original seven patents and expand to other features. Now, 12 patents and 270 individual claims are asserted against the MDC and MMC Products.
This comes after SENKO made what it said were “extensive efforts” to settle in 2023 negotiations with US Conec.
In its lawsuit, SENKO contends that all MDC and MMC connectors and adapters infringe its patents, highlighting a significant discrepancy in the two companies’ patent positions. Further, SENKO said that the timeline of patent filings illustrates its technology achievements, with the company filing multiple VSFF-related patents before US Conec initiated its first MDC or MMC patent filing.
As a key Very Small Form Factor (VSFF) component player, SENKO has a robust portfolio of patents and products, including over 80 issued US Patents. In addition to numerous product patents, SENKO holds patents covering network deployment and applications, which are provided under free license to promote free trade and share the benefits of this technology to the entire industry.
SENKO also offers licensing opportunities for its CS, SN, and SN-MT products.
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