High-density backplane devices
High-density backplane devices
New-generation high-density backplane cable assemblies are available using Omnigrid 2.5-mm connector technology developed by Molex Corp. These hdb assemblies are used for rear or front input/output cable connections in 1SU (41 ckts), 2SU (82 ckts), or 4SU (164 ckts) sizes. The assemblies can be crimp- or axid-terminated with a variety of interfaces suitable for computer, network, and telecommunications equipment.
Cable-Comm Technologies
Westmont, IL
