High-density backplane devices

High-density backplane devices

New-generation high-density backplane cable assemblies are available using Omnigrid 2.5-mm connector technology developed by Molex Corp. These hdb assemblies are used for rear or front input/output cable connections in 1SU (41 ckts), 2SU (82 ckts), or 4SU (164 ckts) sizes. The assemblies can be crimp- or axid-terminated with a variety of interfaces suitable for computer, network, and telecommunications equipment.

Cable-Comm Technologies

Westmont, IL

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