3 SEPTEMBER 2008 -- SCHOTT Electronic Packaging (search for Schott,) has announced that it now offers a hermetic Transistor Outline (TO) that will support Fibre Channel applications of 17 Gbits/sec and beyond.
SCHOTT Electronic Packaging says that recent simulation testing demonstrates that the Fibre Channel protocol offers plenty of potential for meeting tomorrow's data transmission requirements of 17 Gbits/sec and beyond. Robert Hettler, head of research and development opto-electronics at SCHOTT Electronic Packaging, says that several of the company's customers are now testing its TO PLUS Line of products to successfully achieve capacities at such data rates.
Because TO PLUS Line products can have as many as six pins, including higher frequency and DC (electrical) ports, customers are able to package most of the necessary electronics into a regular TO footprint, rather than resorting to bulky and more complex hybrid packages, the company says. Along with these additional pins, TO PLUS Line products feature excellent RF performance in a standard footprint that is ideal for many contract manufacturers and is ready to serve tomorrow's 17G Fibre Channel applications, the company adds.
Further tests are underway at SCHOTT Electronic Packaging to enable the TO to perform beyond 17G and potentially serve the 25G regime, results of which would be available in autumn 2008.
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