OIF to highlight 56G interfaces, pluggable coherent transceivers at OFC

The Optical Internetworking Forum (OIF) says its annual tech demo at OFC this year will focus on 56-Gbps electrical interfaces and the group's work on CFP2 coherent optical transceivers.

The Optical Internetworking Forum (OIF) says its annual tech demo at OFC this year will focus on 56-Gbps electrical interfaces and the group's work on CFP2 coherent optical transceivers.

Under the banner "OIF Technology Showcase 2015 – It's Happening Now – 56G Electrical Interfaces and Pluggable Coherent Optics" at Booth 613 March 24-26, OIF members will highlight technology advances based on both the group's fourth-generation Common Electrical Interface, CEI-56G (see "OIF launches 56-Gbps electrical interface projects") as well as its CFP2-ACO (analog coherent optics) technology (see "OIF to explore Transport SDN, CFP2"). The demonstrations will highlight both capabilities and interoperability.

The showcase will feature live and static displays. The live displays are slated to include:

  • CEI-56G-VSR-NRZ Channel with Credo Semiconductor, Multilane, Tektronix, Yamaichi Electronics
  • CEI-56G-VSR-PAM QSFP Compliance Board with Anritsu, Molex, Multilane, TE Connectivity, Tektronix, Yamaichi Electronics
  • CEI-56G-MR/LR-PAM Backplane with Keysight Technologies, Molex
  • CEI-56G-MR/LR-NRZ Backplane with Credo Semiconductor, Keysight Technologies, TE Connectivity
  • CEI-56G-MR-NRZ Passive Copper Cable with Credo Semiconductor, Keysight Technologies, Molex, TE Connectivity, Yamaichi Electronics
  • CFP2-Analog Coherent Optics – Pluggable Coherent Optics with Keysight Technologies, Multilane.

The static displays will include a CEI-56G-VSR-PAM Optical Static Display (concept) with Molex, Multilane, and TE Connectivity. Other static displays focused on 56G electrical interfaces and pluggable coherent optics will include modules, test equipment, connectors, compliance boards, DSPs, drivers, transimpedance amplifiers, and components from ClariPhy Communications, Finisar, Inphi, Kandou Bus, MACOM, Molex, MoSys, Multilane, NEC, Oclaro, Qorvo, and TE Connectivity.

"The OIF has always demonstrated industry leadership, and this year at OFC is no exception," says Nathan Tracy, technologist at TE Connectivity and the OIF technical committee chair. "Our work on 56-Gbps interoperable electrical channel agreements is addressing multiple modulation solutions. By attracting developers whose expertise ranges from test equipment to optics to electronics to connectors to equipment OEMs, the OIF is developing the ecosystems required by future datacomm architectures."

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