NetLogic to demo 100GbE PHY IC at OFC/NFOEC

MARCH 20, 2009 -- NetLogic Microsystems claims its NLP10142 is the industry's first 100GbE PHY technology supported by a broad 100GbE ecosystem, with partners Xilinx, Avago, and Ixia.

MARCH 20, 2009 -- NetLogic Microsystems Inc., designer and developer of knowledge-based processors and high-speed ICs, has announced that it will be demonstrating its NLP10142 100GE physical layer (PHY) technology at OFC/NFOEC 2009, Booth #3045, from March 24-26, at the San Diego Convention Center.

NetLogic Microsystems will be showcasing the PHY in a complete end-to-end 100GbE environment that is compliant with Draft 2.0 of the IEEE 802.3ba specifications along with ecosystem partners Xilinx, Avago, and Ixia (search Lightwave for Xilinx, Avago, and Ixia). The demonstration will include NetLogic's NLP10142 100GbE PHY, Xilinx's Virtex-5 TXT FPGA, Sarance Technologies' 100GbE PCS and MAC for Xilinx FPGAs, Avago Technologies' 850-nm VCSEL-based parallel optic transmit/receive modules, and Ixia's 100GbE IP test platform.

"Key growth vectors like video-intensive IP traffic and the media-rich content being generated around social networking web sites, coupled with data center convergence around Ethernet and FCoE is driving the need for higher-bandwidth Ethernet pipes in data center, metro edge, and core networks," says John D'Ambrosia, IEEE P802.3ba 40G/100G Ethernet Task Force chair, and senior scientist at Force10 Networks. "This multivendor demonstration organized by NetLogic Microsystems to showcase its 100G PHY ICs demonstrates the feasibility of merchant PHY, MAC, optics, and test solutions for 100GE. This will enable switch and router OEM system integrators to start the task of building and testing tomorrow's Ethernet networks."

NetLogic says the PHY technology seamlessly connects to the Xilinx Virtex-5 TXT device, and supports 100-Gbps transmissions over at least 40 km on singlemode fiber (SMF) cabling, at least 100 m on OM3 multimode fiber (MMF), or at least 10 m over a copper cable assembly. It will be offered in lead-free packaging to allow customers to develop environmentally friendly systems that comply with certain green-initiative regulations.


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