MARCH 8, 2010 -- IPtronics has announced the availability of a 16-Gbps version of its 4- and 12-channel VCSEL drivers and TIAs for parallel optics.
By leveraging existing technologies that are in mass production today, IPtronics says it can offer a low-risk path to more throughput. The new 16-Gbps integrated circuits have identical footprints to the company’s current 4- and 12-channel electronics offerings, which operate at channel speeds of from 4 to 12.5 Gbps (see "IPtronics Releases second-gen 12x10G silicon"). This makes for a seamless transition path for module manufacturers as well as for system manufacturers in re-qualifying for higher speeds, IPtronics asserts.
“By monitoring dynamics in the market place and designing for the future, we are pleased to enable the ever-growing need for more bandwidth with solutions that are cost-efficient and fully available,” says Jesper Bek, CEO at IPtronics Inc. “As opposed to more exotic technologies, the hybrid approach still offers the best cost per Gbps.”
The devices are sampling and come in two versions, wirebond and solder ball. IPtronics bases its solder-bump devices on an established flow with its supplier, ST Microelectronics. This flow is easily scalable to very high volumes and offers better signal integrity than a traditional wirebond process, says IPtronics. All the chips offered by IPtronics are lead-free and ROHS compliant.
Production quantities available from June 2010.
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