GigOptix to launch 40G and 100G bundles

Sept. 15, 2010
SEPTEMBER 15, 2010 -- GigOptix Inc., a supplier of electronic and electro-optic components for 40G and 100G optical networks, will showcase its 40G and 100G Bundled Solutions at the 36th European Conference and Exhibition on Optical Communications (ECOC) in Torino, Italy from September 20 through 22, 2010.

SEPTEMBER 15, 2010 -- GigOptix Inc., a supplier of electronic and electro-optic components for 40G and 100G optical networks, will showcase its 40G and 100G Bundled Solutions at the 36th European Conference and Exhibition on Optical Communications (ECOC) in Torino, Italy from September 20 through 22, 2010.

The Bundled Solutions combines a Transimpendance Amplifier (TIA), Thin Film Polymer on Silicon (TFPS) Mach-Zehnder Modulator (MZM), and a matched driver for an optical application. The Bundled Solution reduces customer engineering expenditure, accelerates time-to-market for new products, and enables customers to leverage GigOptix' low-power tools with enhanced cost efficiencies, according to a company spokesperson. GigOptix Bundles will address 40G DPSK, 40G RZ-DQPSK, and Coherent 40G and 100G DP-QPSK applications.
"Our Bundled Solutions, comprised of a driver, modulator, and receiver amplifier, are a new approach representing a strong value proposition for customers, as well as a competitive advantage for GigOptix as these products are not currently available from any other single supplier," states Padraig O'Mathuna, GigOptix vice president of marketing.
"Today's supply chain requires customers to buy a modulator from one vendor, a driver from a second, and a TIA potentially from a third vendor,” O’Mathuna adds. “Ensuring that all these components are correctly matched is critical for the optimal performance of the system and poses a challenge when designing, for example, a 100G transponder for manufacture. At GigOptix, the TIA, driver, and modulator designs are optimized to work together to achieve the best performance and power efficiency while reducing customers' R&D costs and development cycles.”