Credo releases 3.2-Tbps BlueJay retimer chiplet with 56-Gbps lane rates for multi-chip module ASICs

Dec. 2, 2021
The BlueJay chiplet targets multi-chip-module (MCM) ASICs used in advanced switching, high-performance computing, artificial intelligence (AI), and machine learning applications.

Credo says it now offers the 3.2-Tbps BlueJay retimer chiplet, designed to support 64 lanes of 56-Gbps PAM4 LR DSP connectivity. The BlueJay chiplet targets multi-chip-module (MCM) ASICs used in advanced switching, high-performance computing, artificial intelligence (AI), and machine learning applications.

The retimer chiplet communicates with the MCM system-on-chip (SoC) core on the host side using what Credo asserts is an ultra-low-power Bunch of Wires (BoW) die-to-die interface. The wide-bus BoW interface is optimized for the TSMC CoWoS packaging technology for high-performance computing applications. On the line side, the chiplet supports 64 lanes of 56G PAM4 LR SerDes that Credo says enables smooth integration in various system-level configurations. The SerDes designed enables the BlueJay chiplet to be manufactured in TSMC's 28-nm process, Credo adds.

Use of the chiplet approach, which moves the SerDes off-chip, frees as much as 30% of ASIC die area for other functions, such as additional compute, increased switching performance, and deeper routing tables. “Integrating chiplets allows our customers to accelerate ASIC designs with increased performance to support advanced switching, storage, high-performance computing, AI, machine learning, and service provider applications. These data-intensive applications place a wide range of architectural demands on next-generation ASICs,” said Michael Girvan Lampe, vice president of worldwide sales at Credo.

“Networking and data center architectures are transitioning their infrastructure from 400 Gbps to 800 Gbps and beyond, requiring higher-performance, lower-power ASICs that combine digital core and analog interface functionality,” commented Alan Weckel, founder and technology analyst at 650 Group, via a Credo press release. “However, achieving performance in a monolithic ASIC component is challenging since analog and digital process nodes advance at different rates. Multi-chip modules using Credo’s retimer chiplets decouple the analog interface from the digital core ASIC, reducing costs, lowering risk, and enabling the accelerated transition cycle.”

For related articles, visit the Optical Technologies Topic Center.

For more information on communications semiconductors and suppliers, visit the Lightwave Buyer’s Guide.

To stay abreast of optical communications technology, subscribe to Lightwave’s Enabling Technologies Newsletter.

About the Author

Stephen Hardy | Editorial Director and Associate Publisher, Lightwave

Stephen Hardy is editorial director and associate publisher of Lightwave and Broadband Technology Report, part of the Lighting & Technology Group at Endeavor Business Media. Stephen is responsible for establishing and executing editorial strategy across the both brands’ websites, email newsletters, events, and other information products. He has covered the fiber-optics space for more than 20 years, and communications and technology for more than 35 years. During his tenure, Lightwave has received awards from Folio: and the American Society of Business Press Editors (ASBPE) for editorial excellence. Prior to joining Lightwave in 1997, Stephen worked for Telecommunications magazine and the Journal of Electronic Defense.

Stephen has moderated panels at numerous events, including the Optica Executive Forum, ECOC, and SCTE Cable-Tec Expo. He also is program director for the Lightwave Innovation Reviews and the Diamond Technology Reviews.

He has written numerous articles in all aspects of optical communications and fiber-optic networks, including fiber to the home (FTTH), PON, optical components, DWDM, fiber cables, packet optical transport, optical transceivers, lasers, fiber optic testing, and more.

You can connect with Stephen on LinkedIn as well as Twitter.

Sponsored Recommendations

Your Guide to Data Center Testing Success

Aug. 22, 2024
Each new generation of high-speed computing standards promises faster data rates and new engineering challenges. This guide offers a glimpse into the latest design and test automation...

Fiber Optic Connectivity

Aug. 16, 2024
Date: September 10, 2024Time: 1:00 PM EDT / 12:00 PM CDT / 10:00 AM PDT / 5:00 PM GMT Sponsor: Sumitomo & Tempo CommunicationsDuration: 1 Hour Register Today...

New Engineering Essentials for High-Speed Digital Design

Aug. 22, 2024
Pushing the boundaries of high-speed digital performance demands innovative development methods. This guide outlines everything you need to tackle complex designs, high-speed ...

PON Evolution: Going from 10G to 25, 50G and Above

July 23, 2024
Discover the future of connectivity with our webinar on multi-gigabit services, where industry experts reveal strategies to enhance network capacity and deliver lightning-fast...