HYC to unveil integrated Z-block subassemblies for 400G transceivers at OFC 2023

Feb. 16, 2023
The company says the receiver subassemblies integrate the necessary receptacle, collimator, Z-block, lens array, and prism.

Chinese passive component supplier HYC says it will use OFC 2023 March 7-9 in San Diego, CA, to debut a new line of Z-block subassemblies for 400G transceiver applications. The company says the receiver subassemblies integrate the necessary receptacle, collimator, Z-block, lens array, and prism.

The Z-block assemblies leverage HYC's expertise to deliver excellent performance and low cost, the company asserts. The beam size is less than 11 µm for matching with PD arrays. The subassemblies can support CWDM or LAN-WDM, and the switch only needs to replace the Z-block component based on TFF technology. Pitch values can be 500 ±3 µm, 750 ±3 µm, or customized.

HYC says it anticipates that it will be able to produce 800G versions of the subassemblies in the future. The devices, as well as other elements of the company’s product portfolio, will be on display at OFC in Booth 2622

For related articles, visit the Optical Technologies Topic Center.

For more information on optical components and suppliers, visit the Lightwave Buyer’s Guide.

To stay abreast of optical communications technology, subscribe to Lightwave’s Enabling Technologies Newsletter.